1 Daniel Esperante, Carlos Lacasta 1/13Presentación grupo, IFIC - 6 Marzo 2012 Índice Status de las actividades para la futura producción de los módulos DEPFET para Belle II: Transparencias de lo que se presentó en el workshop de Viena PXD-SVD: ➘ Colaboración con el CNM para ensamblar los módulos ➘ Máquinas rayos X y flip-chip ➘ Actividades actuales y próximas BEAST-II Taki chip PXD-SVD meeting

2 Daniel Esperante, Carlos Lacasta 2/13Presentación grupo, IFIC - 6 Marzo 2012 Plans for production Scheme discussed back in Sep for module production PXD-SVD meeting

3 Daniel Esperante, Carlos Lacasta 3/13Presentación grupo, IFIC - 6 Marzo 2012 Plans for production Work in close collaboration with CNM in the assembly and production of the DEPFET half- ladders, namely: First testing of the half-ladder Rework of detected bump-bonding failures Future plans are based on the following points: Be in (close) contact with CNM to understand which are the important/critical points to assure a successful assembly Prepare the setup and train the people to asses the quality of the final half-ladders PXD-SVD meeting

4 Daniel Esperante, Carlos Lacasta 4/13Presentación grupo, IFIC - 6 Marzo 2012 Infrastructure at IFIC To do that we have available at IFIC  Personal: ➘ 2 Doctors (phys. + eng.) ➘ 2 technicians ➘ 2 students  A clean room class 1000  2 Probe-stations (1 automatic/programmable, the other manual)  1 wire bonder (fully automatic)  From June (now we are in the EU tendering process) ➘ X-ray machine ➘ Flip-chip reworking station PXD-SVD meeting

5 Daniel Esperante, Carlos Lacasta 5/13Presentación grupo, IFIC - 6 Marzo 2012 Immediate Plans Prepare setup for testing:  Set up the new machines and train the technicians: ➘ Test samples to optimize the procedures  Readout needed (able to read 4 DHPs)  Design of probe-card to interface the modules with the readout  A power supply system (ad hoc or “belle II-like” ) will be needed in order to test modules  Software PXD-SVD meeting

6 Daniel Esperante, Carlos Lacasta 6/13Presentación grupo, IFIC - 6 Marzo 2012 Immediate Plans Get experience with the electronics:  Play with the current electronics to deeply understand the way it works ➘ Already offered help screening DCDBs  Next, participate in the preparation of a set of tests and procedures to perform a safe and reliable testing of the modules by: ➘ Studying the different failure modes: Assuming worst case scenarios, ie, power contacts missing, how to detect them without damaging anything? How to disentangle which chip is bad? Ask CNM to provide samples with failures PXD-SVD meeting

7 Daniel Esperante, Carlos Lacasta 7/13Presentación grupo, IFIC - 6 Marzo 2012 X-ray machine Use:  During optimization of flip-chip process  During module testing for quality check (detect/find problems)  Shield sensitive area ? Characteristics  At least 100 KV (max. 130 kV)  10 W (max. 39 W)  3μm detail detectability  5 axis (rotation)  Automatic software to detect: shorts, openings, voids, ball size and shape, misalignments  Also automatic software to analyze wire-bonds quality and characteristics like wire separation, height, uniformity, … Could do some tests by one of the vendors PXD-SVD meeting

8 Daniel Esperante, Carlos Lacasta 8/13Presentación grupo, IFIC - 6 Marzo 2012 Tests on samples from Heidelberg 70kV 60μA 128 integrations Samples sent to IFIC by Christian Kreidl for thermal tests long ago... PXD-SVD meeting

9 Daniel Esperante, Carlos Lacasta 9/13Presentación grupo, IFIC - 6 Marzo 2012 Tests on samples from Heidelberg 50kV 50μA max. 256 integrations Samples sent to IFIC by Christian Kreidl for thermal tests long ago... PXD-SVD meeting

10 Daniel Esperante, Carlos Lacasta 10/13Presentación grupo, IFIC - 6 Marzo 2012 Tests on samples from Heidelberg 90kV 30μA max. 256 integrations Samples sent to IFIC by Christian Kreidl for thermal tests long ago... PXD-SVD meeting

11 Daniel Esperante, Carlos Lacasta 11/13Presentación grupo, IFIC - 6 Marzo 2012 Test on samples from Heidelberg 90kV 30μA max. 256 integrations Samples sent to IFIC by Christian Kreidl for thermal tests long ago... PXD-SVD meeting

12 Daniel Esperante, Carlos Lacasta 12/13Presentación grupo, IFIC - 6 Marzo 2012 Tests on samples from Heidelberg 70kV 50μA max. 256 integrations Samples sent to IFIC by Christian Kreidl for thermal tests long ago... PXD-SVD meeting

13 Daniel Esperante, Carlos Lacasta 13/13Presentación grupo, IFIC - 6 Marzo 2012 Flip/Chip + rework station Use:  Placement of passive components  Rework non working modules ➘ At least remove non-working ASIC and prepare the region for the next iteration Rework station, flip-chip machine characteristics:  Specific tools to handle the DEPFET chips  Unsolder single components  Solder cleaning: ➘ Suck out mechanism ➘ Different nozzles and both nozzles and chuck with temperature ramping control  Stereo microscope Placement of passive components:  Programmable system to dispense solder paste/adhesives Module to do flip-chip (ultrasounds + thermal) No possibility to make tests by any of the companies... PXD-SVD meeting

14 Daniel Esperante, Carlos Lacasta 14/13Presentación grupo, IFIC - 6 Marzo 2012 Module production preparation Se nos ha pedido presentar un plan de trabajo en el que se especifiquen una serie de pasos que vamos a seguir en cuanto a QA y QC (Quality Assurance & Control) para el ensamblado y testeado de los módulos: Habrá que coordinarlo con el CNM (Enric & Mohktar) y Laci Hemos contactado con ellos y hecho una reunión para entender bien cuales son las partes críticas del ensamblado (reducción del cobre, flip-chip, tests pre-producción, durante la producción…) Hay que empezar pronto a definir: Qué se va a hacer en cada lugar. Tipos de test antes y durante la producción y dónde se harán los tests Qué material vamos a necesitar en el IFIC para practicar con nuestras máquinas Gente involucrada

15 Daniel Esperante, Carlos Lacasta 15/13Presentación grupo, IFIC - 6 Marzo 2012 Setup preparation En estos momentos: Preparación del sistema de alimentaciones con las fuentes y del readout: Construcción del hardware e integración del readout Sistema alimentaciones (fuentes, picoamperímetro, sensores de corriente…), tarjeta de punta de pruebas (¿?), laser(¿?), … Desarrollo del software. (Aquí hace falta mano de obra) Se le ha pedido a Bonn y Munich una tarjeta de readout (V4) y un híbrido: La tarjeta de readout ha venido para el IFIC. No funcionaba bien y se ha mandado de vuelta a Bonn. El híbrido: por ahora tenemos uno para testear que ponemos bien las alimentaciones. Obtener uno con un PXD 6 va a ser un poco más difícil, y será en el futuro.

16 Daniel Esperante, Carlos Lacasta 16/13Presentación grupo, IFIC - 6 Marzo 2012 BEAST-II Beam Exorcism for A STable experiment II A background detector for the commissioning of the Belle II experiment Synchrotron and neutron backgrounds were unexpectedly problematic in Belle. Synchrotron and neutron backgrounds were unexpectedly problematic in Belle 1. The main purpose of BEAST II is to determine whether is it safe to roll-in the detector → Measure instantaneous and integrated radiation dose at position of Belle II subdetectors and test the beam abort systems 2. SuperKEKB machine needs real time measurements of luminosity and background levels during beam commissioning (tuning of beam optics and moveable mask positions) 3. Detailed understanding of beam background sources needed to validate the simulations → Touschek, Radiative Bhabha, Beam gas, Synchrotron Radiation, Beam Injection Noise C. Mariñas

17 Daniel Esperante, Carlos Lacasta 17/13Presentación grupo, IFIC - 6 Marzo 2012 BEAST-II BEAST II is the apparatus needed to ensure a safe volume for the silicon detectors, before Belle II roll-in It is a ‘complex’ detector, with many different technologies andseveral groups involved BEAST II task force Group and discussion started at November 2011, in B2GM Schedule and commissioning scenario decided, now time to define BEAST II: Clarify what each group can contribute: Modules, equipment, manpower Iterate on setup: Shielding, stages More detailed plan and schedule C. Mariñas

18 Daniel Esperante, Carlos Lacasta 18/13Presentación grupo, IFIC - 6 Marzo 2012 BEAST-II Por ahora… Vamos a colaborar con los sensores de humedad, Tª?, posición?: tanto en buscar sensores resistentes a radiación, hacer los tests, como en desarrollar el readout. Ya veremos si nos involucramos más Yo voy siguiendo los meetings, lunes a 22:30.

19 Daniel Esperante, Carlos Lacasta 19/13Presentación grupo, IFIC - 6 Marzo 2012 TAKI chip Se me ha ocurrido la idea de probar un chip desarrollado por I. Peric (Mannheim): “Large monolithic particle pixel-detector in high-voltage CMOS technology”: Monolítico Fabricado en tecnología CMOS “standard” Resistente a radiación Total DC power consumption of the chip is 50 mW Posibilidad de adelgazamiento Version prototipo 128x128 pixels, 21x21 um2 Habría que estudiarlo como posible opción para ILC… Van a ir al testbeam de Desy.

20 Daniel Esperante, Carlos Lacasta 20/13Presentación grupo, IFIC - 6 Marzo 2012 Esta que ves es la última transparencia